This equipment is used for cleaning wafers, substrates and other materials in semiconductor manufacturing. Suitable for mass automated production. With ECR frame and rotating table, it supports simultaneous batch processing of multiple magazines. This equipment is advanced microwave plasma chemical cleaning. Its main working principle is that appropriate process gas is introduced into the chamber under a certain vacuum state. Under microwave energy, the gas is ionized, and its active free radicals react with the surface substances to be cleaned (generally organic matter)., generating volatile gases that are discharged by the vacuum pump, thereby achieving the cleaning effect.